Scientists from the University of North Florida and Northeastern University developed a new metallic glue called MesoGlue that can bind metal components at room temperature.
It uses very little pressure to solder parts that to without heat it looks and acts like regular silver solder and you can even use the glue to attach chips to heat sinks permanently without thermal paste.
The glue contains engineered nanorods indium and gallium that interlock.When they interlock the shell then liquefies and then bonds the two sides together.The liquid alloy resulting from this process squishes the interlocked nanorods,solidifying the bond.
“The metallic glue has multiple applications, many of them in the electronics industry. As a heat conductor, it may replace the thermal grease currently being used, and as an electrical conductor, it may replace today’s solders. Particular products include solar cells, pipe fittings, and components for computers and mobile devices,” Said Hanchen Huang, chair in the Department of Mechanical and Industrial Engineering at Northeastern University in US.
Compared to standard polymer glue,the metallic glue can function at high temperatures or high pressures,conduct heat and electricity,and is resistant to air or gas leaks.
The study was published in the journal of Advanced Materials and Processes.